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ENG
Bonding gallium arsenide to silicon substrate - Motorola lucks into a way
Authors
Hellemans, A
Citation
A. Hellemans, Bonding gallium arsenide to silicon substrate - Motorola lucks into a way, IEEE SPECTR, 38(10), 2001, pp. 33-34
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE SPECTRUM
ISSN journal
00189235 →
ACNP
Volume
38
Issue
10
Year of publication
2001
Pages
33 - 34
Database
ISI
SICI code
0018-9235(200110)38:10<33:BGATSS>2.0.ZU;2-O