The capacitances of multilayered board vias are calculated by means of two
methods: the Schwarz-Christoffel conformal mapping-finite difference proced
ure and the hybrid FEM/DBCI method. Different structures can be analyzed co
ntaining single or multiple ground planes, with finite or infinite thicknes
s, with or without pads. Comparisons are made with other methods, showing t
hat a greater accuracy is obtained by means of the two methods proposed.