We have carried out a systematic study of the impact of hydrogen exposure o
n InP HEMTs and GaAs PHEMTs with Ti/Pt/Au gates. Hydrogen poisoning is an i
mportant reliability concern in these devices. Our work has provided ample
evidence supporting the formation of TiH inside the gate structure upon exp
osure of HEMTs to a hydrogen environment. The resulting volume expansion of
the gate stresses the semiconductor heterostructure underneath and, throug
h the piezoelectric effect, results in a shift of the threshold voltage of
the device. This mechanism is largely reversible. Independently of this, we
have found that H-2 upsets the stoichiometry of the exposed InAlAs barrier
in the recessed region right next to the gate. This irreversebly changes t
he extrinsic sheet carrier concentration in the channel and affects other f
igures of merit such as the breakdown voltage. This understanding should be
instrumental in identifying device-level solutions to this problem.