We have studied the characteristics of reactive ion etching for zinc tellur
ide using CH4 and H-2 crases. The effects of CH4/H-2 gas composition, total
gas pressure, and plasma power on the etching properties were investigated
. It was found that variation of the CH4 concentration in gas mixtures lead
s to changes in both the etching rate and the surface morphology. The etchi
ng rate of ZnTe increases from 128 to 629 Angstrom /min with increasing the
plasma power from 50 to 300 W at a 4% CH4 concentration and 25 Pa pressure
. A smooth etched ZnTe surface was obtained in the range of 4%-16% CH4 conc
entration and 10-65 Pa. pressure. (C) 2001 American Vacuum Society.