VCSEL ELECTRICAL PACKAGING ANALYSIS AND DESIGN GUIDELINES FOR MULTI-GHZ APPLICATIONS

The introduction of the vertical cavity surface emitting laser (VCSEL) diode structure has created the need for enhanced performance, low co st, optical packages capable of supporting data rates as high as 5 Gb/ s, The popular laser packages, such as the TO-46 and the TO-56 ''cans, '' which have been traditionally used for edge emitting laser diodes a t much lower frequencies, cannot support this dramatic increase in dat a rates, Package parasitics and severe impedance discontinuities, inhe rent in the TO-46 and TO-56, impose stringent frequency limitations an d dramatically effect the integrity of the electrical signals, Because electrical waveform control is essential for proper laser diode opera tion, these high frequency performance problems must be identified and overcome.This paper will describe electromagnetic and SPICE modeling techniques which were used to create equivalent circuits of the TO-46 and the TO-56 cans for comparison to measured results to achieve model verification, Subsequently, the models were used to determine frequen cy limitations associated with the TO-46 and the TO-56 laser cans, Add itionally, the specific problems associated with the operation of a VC SEL laser package operating at high frequencies (i.e., >1 Gb/s) were i dentified; possible solutions for typical driving configurations were then developed, The lessons learned from the analysis of the TO-46 and TO-56 cans were used to determine a rudimentary set of VCSEL package design guidelines. Finally, these guidelines were used to design and m odel a conceptual VCSEL laser package, dubbed optical package for adva nced lasers (OPAL), capable of operation to data rates as high as 5 Gb /s, The modeling techniques used to match the TO-46 and the TO-56 time domain and frequency domain simulations to measurements were extrapol ated to create a model of OPAL, and to evaluate it at high frequencies .