TESTABILITY AND SIGNAL INTEGRITY IN A LOW-COST MULTICHIP-MODULE

The design process for low-cost multichip modules (MCM's) is presented , Modifications to the design are often made in order to increase test ability, Some of these modifications can degrade signal integrity, How ever, The important aspects to consider in order to make rational desi gn tradeoffs are presented, Test strategies and techniques are discuss ed, The effects on signal quality of additional test stubs to the inte rnal nets of the MCM are analyzed, It is shown that the addition of un planned test stubs can degrade the signal pulse quality and any such a dditions must require further signal integrity analysis.