This paper reports on the long-term stability of the resistance of Poly-Si
thin film resistors, implanted with boron (B) or phosphorous (P) atoms, sub
jected to a thermal and electrical stress. The observed degradation in resi
stance after thermal and electrical stress pointed out that the resistance
of Poly-Si films implanted with boron atoms increases for tensile stress, w
hile no changes were observed for Poly-Si films implanted with phosphorus.
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