Stress induced leakage current (SILC) can be regarded as a major oxide reli
ability concern, especially for non-volatile memory application. In this wo
rk, we investigate the SILC at low field in ultra-thin oxides with thicknes
s down to 1.2nm. The SILC generation kinetics after constant voltage stress
is shown to be related to that of interface or near interface oxide traps.
Moreover, the field acceleration of the SILC generation is found to follow
approximately a 1/E model, supporting the anode hole injection process as-
a probable oxide trap creation mechanism. (C) 2001 Elsevier Science Ltd. Al
l rights reserved.