We describe hybrid integration technologies that employ silica-based planar
lightwave circuit (PLC) platforms, and report several high-performance opt
ical devices based on these technologies. First, we discuss three technolog
ies used in hybrid integration; semiconductor optical device alignment with
a silica waveguide, chip bonding using AuSn solder and electrical wiring.
In addition, we describe optical components developed for short- and long-h
aul networks. We realized these high-performance components by combining ap
propriate hybrid integration technologies.