Design of single and multiple zone junction termination extension structures for SiC power devices

Citation
Dc. Sheridan et al., Design of single and multiple zone junction termination extension structures for SiC power devices, SOL ST ELEC, 45(9), 2001, pp. 1659-1664
Citations number
14
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
45
Issue
9
Year of publication
2001
Pages
1659 - 1664
Database
ISI
SICI code
0038-1101(200109)45:9<1659:DOSAMZ>2.0.ZU;2-7
Abstract
The design of SiC planar and non-planar junction termination extension (JTE ) structures are investigated through calibrated quasi-3D numerical simulat ion. JTE techniques are optimized with respect to breakdown voltage, area c onsumption, surface fields, and interface charge. Simulated JTE charge prof iles predict near-ideal breakdown values with surface fields less than 60% of their bulk values, and show that the critical implant activation percent age can vary as much as 40%, with only 10% reduction in breakdown voltage f or lightly doped blocking layers. These results are extended to unique mult iple-zone JTE and mesa-JTE structures applicable to a wide range of planar and non-planar SiC power devices. (C) 2001 Published by Elsevier Science Lt d.