Electroplating of copper from an amine based noncyanide bath

Citation
S. Jayakrishnan et al., Electroplating of copper from an amine based noncyanide bath, T I MET FIN, 79, 2001, pp. 171-174
Citations number
20
Categorie Soggetti
Metallurgy
Journal title
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
ISSN journal
00202967 → ACNP
Volume
79
Year of publication
2001
Part
5
Pages
171 - 174
Database
ISI
SICI code
0020-2967(200109)79:<171:EOCFAA>2.0.ZU;2-6
Abstract
With a view to eliminating the use of toxic cyanide for electroplating copp er, a non-cyanide alkaline bath, using triethanolamine as complexant, has b een investigated. Various steps of bath developments are discussed in this paper These include stability and immersion deposition characteristics of s olutions with varying concentrations, Hull cell experiments to arrive at a plating bath composition and determination of current efficiency and deposi t nature under varying operating parameters to optimise the deposition cond itions.