Pure silica zeolite films as low-k dielectrics by spin-on of nanoparticle suspensions

The preparation of ultra low-k zeolite films with high mechanical strength by a simple spin-on process is demonstrated. Continuous, smooth, thin zeoli te silicalite films with a dielectric constant of 2.1 and elastic modulus o f 16-18 GPa are obtained by this process, which is simple and compatible wi th the requirements of the semiconductor manufacturers. Polishing experimen ts showed that the film is potentially compatible with chemical mechanical polishing (CMP). The described pure silica film could be an attractive cand idate for ultra-low-k materials for future generation microprocessors.