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ENG
Design analysis of a belt furnace for microelectronic ceramic package processing
Authors
Yang, TCK
Lin, HS
Cheng, MC
Wang, SF
Citation
Tck. Yang et al., Design analysis of a belt furnace for microelectronic ceramic package processing, AM CERAM S, 80(10), 2001, pp. 43-48
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
AMERICAN CERAMIC SOCIETY BULLETIN
ISSN journal
00027812 →
ACNP
Volume
80
Issue
10
Year of publication
2001
Pages
43 - 48
Database
ISI
SICI code
0002-7812(200110)80:10<43:DAOABF>2.0.ZU;2-9