Hot filament chemical vapor deposition of polyoxymethylene as a sacrificial layer for fabricating air gaps

Citation
Ls. Lee et Kk. Gleason, Hot filament chemical vapor deposition of polyoxymethylene as a sacrificial layer for fabricating air gaps, EL SOLID ST, 4(11), 2001, pp. G81-G84
Citations number
26
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
ELECTROCHEMICAL AND SOLID STATE LETTERS
ISSN journal
10990062 → ACNP
Volume
4
Issue
11
Year of publication
2001
Pages
G81 - G84
Database
ISI
SICI code
1099-0062(200111)4:11<G81:HFCVDO>2.0.ZU;2-L
Abstract
A method for synthesizing polyoxymethylene (POM) film at high deposition ra tes was achieved via hot filament chemical vapor deposition (HFCVD). Nuclea r magnetic resonance spectra show that the structure of the polymer is line ar, rather than cross-linked (which plasma enhanced CVD would have produced ). The linear structure is responsible for its ease of decomposition at les s than 300 degreesC and leaving behind negligible residue. Thus, the HFCVD POM film is proposed as a novel sacrificial layer for fabricating air gaps, as it could offer the advantages of shorter removal time, decreased heat l oad, and ease of process integration over conventional methods and material s. (C) 2001 The Electrochemical Society.