Ch. Tseng et al., Effects of excimer laser dopant activation on low temperature polysilicon thin-film transistors with lightly doped drains, EL SOLID ST, 4(11), 2001, pp. G94-G97
Excimer laser annealing has been utilized to manufacture low temperature po
lycrystalline silicon thin-film transistors with lightly doped drain (LDD)
structures. The excimer laser annealing can effectively reduce the thermal
budget of source/drain dopant activation, namely, without substrate heating
. With the advantages of LDD structure, high performance device characteris
tics with a low "off" state current of 4.38 x 10(-12) A/mum, high on/off cu
rrent ratio of 1.6 x 10(7). and good field-effect mobility of 268 cm(2)/V s
. can be achieved simultaneously. (C) 2001 The Electrochemical Society.