Physics-based CAD models for the analysis of vias in parallel-plate environments

In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radi al transmission-line theory. The crosstalk power transferred by the TEM par allel-plate mode between vias is characterized, and extended to the treatme nt of vias in finite substrates by means of image theory. The presented CAD models can be combined with lumped and distributed circuit elements, as we ll as linear and nonlinear devices, providing an accurate and fast procedur e for the global modeling of high-speed electronic circuits. The correspond ing simulation time for representative single or multiple via configuration s has been drastically reduced compared to full-wave simulations while main taining comparable accuracy.