High-Q LTCC-based passive library for wireless system-on-package (SOP) module development

In this paper, we present the development and full characterization and mod eling of a multilayer ceramic-based system-on-package component library. Co mpact high-Q three-dimensional inductor and capacitor topologies have been chosen and incorporated. A measured inductor Q factor as high as 100 and se lf-resonant frequency as high as 8 GHz have been demonstrated. The new vert ically interdigitated capacitor topology occupies nearly an order of magnit ude less of real estate while demonstrating comparable performance to the c onventional topology. The low-temperature co-fired ceramic (LTCC) library h as been incorporated into a 1.9-GHz CMOS power-amplifier design exhibiting a measured 17-dB gain, 26-dBm output power, and 48% power added efficiency. This power-amplifier module with fully integrated LTCC passives: demonstra tes a superior performance to those with full and partial on-chip passive i ntegration.