Development of a millimeter-wave system-on-a-package utilizing MCM integration

We present the development of a system-on-a-package at millimeter-wave freq uencies utilizing a commercially available multichip-module process. This t echnology has established a platform for integrating multiple components of different material systems to combine digital application-specific integra ted circuits (ASICs), radio-frequency integrated circuits, and microelectro mechanical devices onto a package. The multilayer polymer thin films also e mpower the design and fabrication of integral passive devices, including th in-film resistors, filters, and Wilkinson power combiners.