Electrical effects of plasma enhanced chemical vapor deposition of SiNx onGaAs Schottky rectifiers

Citation
B. Luo et al., Electrical effects of plasma enhanced chemical vapor deposition of SiNx onGaAs Schottky rectifiers, J APPL PHYS, 90(9), 2001, pp. 4800-4804
Citations number
22
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
90
Issue
9
Year of publication
2001
Pages
4800 - 4804
Database
ISI
SICI code
0021-8979(20011101)90:9<4800:EEOPEC>2.0.ZU;2-A
Abstract
The diode ideality factor, reverse breakdown voltage, and forward current c haracteristic were used to measure the effect on electric performance of Ga As rectifiers deposited with thin films of SiNx. Over a broad range of depo sition conditions there were minimal changes (< 10%) in breakdown voltage a nd the cause was hydrogen passivation of Si dopants in the GaAs. Ion-induce d damage did not appear to play a significant role in the results. The idea lity factors and forward leakage currents were essentially unchanged by the SiNx deposition indicating that the plasma exposure did not create defects states around the periphery of the Schottky contact. (C) 2001 American Ins titute of Physics.