Second-order sound field during megasonic cleaning of patterned silicon wafers: Application to ridges and trenches

Authors
Deymier, PA Vasseur, JO Khelif, A Raghavan, S
Citation
Pa. Deymier et al., Second-order sound field during megasonic cleaning of patterned silicon wafers: Application to ridges and trenches, J APPL PHYS, 90(8), 2001, pp. 4211-4218
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
90
Issue
8
Year of publication
2001
Pages
4211 - 4218
Database
ISI
SICI code
0021-8979(20011015)90:8<4211:SSFDMC>2.0.ZU;2-R