M. Seo et al., Cathodic decomposition and anodic dissolution and changes in surface morphology of n-type InP in HCl, J ELCHEM SO, 148(10), 2001, pp. B400-B404
The cathodic decomposition of the n-InP(100) plane and followed by anodic d
issolution of deposited indium were investigated in relation to surface rou
ghening. The cathodic decomposition proceeded in parallel with hydrogen evo
lution when the n-InP(100) plane was cathodically polarized in 1.0 M HCl at
potentials lower than -0.6 V (vs. standard hydrogen electrode). Metallic i
ndium was deposited as a result of the cathodic decomposition. and anodical
ly dissolved at potentials higher than -0.5 V during anodic potential sweep
after the cathodic decomposition. The reaction fraction of cathodic decomp
osition could be determined from the ratio of the charge for anodic dissolu
tion of deposited indium to the total charge for cathodic decomposition and
hydrogen evolution, and took a maximum value of x = 0.5 for cathodic polar
ization at -0.75 V for 50 s. The changes in surface morphology of InP were
observed with an atomic force microscope. The roughness of the InP surface
increased with repeating the cathodic decomposition and anodic dissolution
of deposited indium. When the cyclic potential steps between -0.75 V for 30
s and -0.3 V for 30 s were performed, the mean value of surface roughness,
R-a, increased with increasing cycle number up to 150 cycles and then atta
ined a steady state of R-a = 25 nm. (C) 2001 The Electrochemical Society.