M. Uematsu et al., Oxidation simulation of heavily phosphorus-doped silicon based on the interfacial silicon emission model, JPN J A P 1, 40(9A), 2001, pp. 5197-5200
Silicon oxidation of heavily phosphorus-doped substrates is simulated based
on the interfacial silicon emission model. We assume that double negativel
y charged vacancies (V2-) from the substrates reduce the interfacial silico
n emission, which governs the oxidation rate at the interface. The simulati
on is done by reducing the rate of Si-atom emission according to the concen
tration of V2- estimated from the carrier concentration of the substrates.
In addition, the equilibrium concentration of oxygen in the oxide is increa
sed with increasing P concentration to fit the experimental oxide thickness
.