Novel rapid-cure adhesives for low temperature using thiirane compound

We investigated improvement of workability (viscosity), storage stability, and curing ability of thiirane resin for adhesive applications. The viscosi ty of bisphenol-F thiirane resin was lower than that of bisphenol-A thiiran e resin, especially at low temperatures, thus improving ease of handling. A ddition of diphenyl decyl phosphite improved its storage stability to a lev el similar to that of bisphenol-A epoxy resin. The curing of bisphenol-F th iirane resin increased three times faster by adding 2,4,6-tris(dimethylamin omethyl)phenol (DMP-30) as a tertiary amine. In applications of this new th iirane resin as civil and architectural adhesives, a superior curing abilit y at low temperature was attained. (C) 2001 John Wiley & Sons, Inc.