Effect of stress on the electrical resistivity of solder

Authors
Kim, T Chung, DDL
Citation
T. Kim et Ddl. Chung, Effect of stress on the electrical resistivity of solder, J ELEC MAT, 30(10), 2001, pp. L29-L31
Citations number
25
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
30
Issue
10
Year of publication
2001
Pages
L29 - L31
Database
ISI
SICI code
0361-5235(200110)30:10<L29:EOSOTE>2.0.ZU;2-1
Abstract
The electrical resistivity of tin-lead eutectic solder was found to increas e upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect w as due to plastic deformation.