Modelling of inductively coupled plasma processing reactors

A comprehensive model has been developed to study low-pressure, high-densit y plasma processing reactors. The model couples plasma generation and trans port self-consistently to fluid flow and gas energy equations. The model an d the simulation software have been used to analyse chlorine plasmas used i n metal etching. The effect of the inductive coil frequency on the plasma c haracteristics has been examined and found to influence plasma uniformity o nly moderately. Model predictions for a CF4 plasma have been found to agree well with experimental results.