Jk. Holt et al., Gas phase and surface kinetic processes in polycrystalline silicon hot-wire chemical vapor deposition, THIN SOL FI, 395(1-2), 2001, pp. 29-35
Experiments and numerical simulations have been conducted to determine crit
ical parameters for growth of polycrystalline silicon via hot-wire chemical
vapor deposition. Reactor-scale simulations performed using the Direct Sim
ulation Monte Carlo (DSMC) method have revealed a number of important pheno
mena such as a sharp drop of 1700 K in the gas temperature from the wire to
substrate. The gas-phase reaction of silicon atoms produced on the wire wi
th ambient silane molecules has been studied using ab initio quantum chemic
al calculations. Results reveal that collisional stabilization of the adduc
t (H3SiSiH) is unlikely under typical growth pressures, but an energeticall
y favorable, low-pressure pathway has been found that leads to the formatio
n of Si2H2 and H-2. Threshold ionization mass spectrometry measurements of
radicals have revealed that at the pressure characteristic of growth (2-200
mTorr of 1% SiH4 in He), the radical SiH2 is predominant. Finally, film gr
owth studies reveal that hot-wire-produced atomic hydrogen may preferential
ly etch amorphous silicon and suppress the formation of small nuclei. (C) 2
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