We have investigated the formation of poly-Si photoactive films by the cata
lytic chemical vapor deposition (Cat-CVD) method. By optimum control of the
substrate deposition temperature, poly-Si films with a crystalline fractio
n higher than 90% and dangling-bond density of 2.5 x 10(16) cm(-3) were obt
ained at a deposition rate greater than 10 Angstrom s(-1). It was also foun
d that the lateral grain size of the poly-Si films increases from 0.1 to 0.
5 mum by suppressing, chemical transport from the chamber wall. (C) 2001 El
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