B. Schroeder et al., Current status of the thermo-catalytic (hot-wire) CVD of thin silicon films for photovoltaic applications, THIN SOL FI, 395(1-2), 2001, pp. 298-304
Thermo-catalytic (TC) or hot-wire (HW) chemical vapor deposition (CVD) is a
promising technique for growing amorphous and microcrystalline silicon fil
ms with improved stability and high rates. In this paper we report an the p
hotovoltaic (PV) applications of thin silicon films deposited by this metho
d. After a short review of the history of PV applications of TCCVD, from th
e be.-inning in 1993, the main part of the paper deals with our research an
d development of films and interfaces needed for the fabrication of differe
nt solar cell structures entirely by TCCVD. So far, our highest conversion
efficiency is eta = 10.2% for a pin structure, containing only an intrinsic
a-Si:H film deposited by TCCVD. Depositing the whole pin structure entirel
y by TCCVD, we have obtained eta = 8.8% until now. After development of a t
unnel junction, the first tandem solar cell device, a stacked pin-pin struc
ture has been recently produced showing eta = 7%. First attempts have been
made for large-area deposition. In a 30X30 cm(2) batch system, a-Si:H films
with device grade photoelectronical properties and high thickness uniformi
ty can be produced at a high rate of 6 Angstrom /s. When incorporating i-la
yers from this system into pin solar cells, a conversion efficiency of eta
= (6.4 +/-0.8)% was obtained on an area of 20X20 cm(2). Finally, we report
on silicon wafer-based solar cells, where a-Si, Lc-Si and epi-Si film emitt
ers were deposited by TCCVD showing conversion efficiencies up to eta = 15.
2%. (C) 2001 Elsevier Science B.V. All rights reserved.