This review presents the basic ideas and some examples of the chip technolo
gy of high-power diode lasers (lambda = 650 nm - 1060 nm) in connection wit
h the achievements of mounted single-stripe emitters in recent years.
In the first section the optimization of the epitaxial layer structure for
a low facet load and high conversion efficiency is discussed. The so-called
broadened waveguide Large Optical Cavity (LOC) concept is described and al
so some advantages and disadvantages of Al-free material. The next section
deals with the processing steps of epitaxial wafers to make single emitters
and bars. Several possibilities to realize contact windows (implantation,
insulators, and wet chemical oxidation) and laser mirrors are presented. Th
e impact of heating in the CW regime and some aspects of reliability are th
e following topics. The calculation of thermal distributions in diode laser
s, which shows the need for sophisticated mounting, will be given. In the l
ast part the current state-of-the-art of single-stripe emitters will be rev
iewed.