Cooling and packaging of high-power diode lasers

Authors
Loosen, P
Citation
P. Loosen, Cooling and packaging of high-power diode lasers, T APPL PHYS, 78, 2000, pp. 289-301
Citations number
5
Categorie Soggetti
Current Book Contents
Journal title
HIGH-POWER DIODE LASERS: FUNDAMENTALS, TECHNOLOGY, APPLICATIONS → ACNP
ISSN journal
03034216
Volume
78
Year of publication
2000
Pages
289 - 301
Database
ISI
SICI code
0303-4216(2000)78:<289:CAPOHD>2.0.ZU;2-M
Abstract
An overview of cooling and packaging of high-power diode lasers is given. T he discussion concentrates on diode lasers in bar geometry, typically 10 mm -wide, which are soldered on actively cooled micro-channel heat sinks; made from copper.