Sza. Zaidi et al., EFFECTS OF COMPOSITION AND SUBSTRATE-TEMPERATURE ON THE AC PROPERTIESOF COEVAPORATED MN SIOX THIN-FILMS/, Journal of Materials Science, 32(15), 1997, pp. 3921-3924
Capacitance, a.c, conductance and loss factor have been measured in Cu
-Mn/SiOx-Cu sandwich structures with compositions 1, 3, 5 and 10 at% M
n in the frequency range 10-10(6) Hz between temperatures of 110 and 5
00 K. The capacitance has a weak minim um at 1.0 MHz for all temperatu
res, whilst the a.c. conductance increases between four and eight orde
rs of magnitude for temperatures of 150 and 473 K, respectively. Vario
us a.c. conduction models have been considered, and it has been conclu
ded that correlated barrier hopping best describes the results. The Go
swami-Goswami model was used to describe the variation of loss factor
with temperature and composition.