Current and future ferroelectric nonvolatile memory technology

Citation
Gr. Fox et al., Current and future ferroelectric nonvolatile memory technology, J VAC SCI B, 19(5), 2001, pp. 1967-1971
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
19
Issue
5
Year of publication
2001
Pages
1967 - 1971
Database
ISI
SICI code
1071-1023(200109/10)19:5<1967:CAFFNM>2.0.ZU;2-V
Abstract
Ferroelectric random access memories (FRAMs (R)) are nonvolatile integrated circuit memories that store data by using the field switchable polarizatio n state of a ferroelectric material. Besides allowing unique applications, FRAM memories are ideal replacements for standard random access memory, era sable programmable read-only memory, and Flash memories due to their fast a ccess speed, low power consumption, extended read/write endurance, and abil ity to store data without the need for battery backup power. FRAM memories have been mass produced since 1992 and memory densities up to 256 kbit are currently available for purchase. Current applications include smart cards, data collection and storage (e.g., power meters), configuration storage, a nd buffers. The ferroelectric material at the core of FRAM is perovskite Pb Zr1-xTixO3 (PZT). Current FRAM cell designs utilize the PZT in a bistable c apacitor structure that is integrated with a transistor or a complementary capacitor and two transistors. A review of ferroelectric performance in cur rent memory products will be presented. Recent development has lead to capa citor performance with endurance beyond 10(12) read/write cycles and operat ion at 1.8 V. A roadmap for future FRAM development will be presented. (C) 2001 American Vacuum Society.