LOW-TEMPERATURE SINTERING OF ALUMINUM NITRIDE SUBSTRATE WITH HIGH THERMAL-CONDUCTIVITY

Authors
Citation
Wg. Miao et al., LOW-TEMPERATURE SINTERING OF ALUMINUM NITRIDE SUBSTRATE WITH HIGH THERMAL-CONDUCTIVITY, Journal of materials science letters, 16(15), 1997, pp. 1245-1246
Citations number
7
Categorie Soggetti
Material Science
ISSN journal
02618028
Volume
16
Issue
15
Year of publication
1997
Pages
1245 - 1246
Database
ISI
SICI code
0261-8028(1997)16:15<1245:LSOANS>2.0.ZU;2-9