Nano-scratch study of molecular deposition (MD) films on silicon wafer using nanoindentation

Experiment of the molecular deposition (MID) films with and without alkyl t erminal deposited on the silicon wafer were conducted by using nanoindentat ion. It was found that MID films and alkyl terminated MID films exhibit hig her critical load (scratch resistance or adhesive strength) and lower coeff icient of friction compared with the silicon substrate. Critical load (scra tch resistance) increases with the number of layers, and coefficients of fr iction of those MID film with alkyl terminal are still best for the same la yer of MD film.