Electrodeposition of Cu/Ni-P multilayers by a single bath technique

Cu/Ni-P multilayers, comprised of alternatively formed 'nano-size' sublayer s of Cu and Ni-P, have been successfully produced from a single bath using modulated (i.e. periodic pulse control) current density. The chemical compo sition and the crystallinity of resultant deposits are influenced by the de position current density. Transmission electron microscopy (TEM) examinatio n of our multilayer sample clearly showed the formation of alternative subl ayers of Cu and Ni-P (thickness similar to 50 nm). Electrolysis at a cathod ic current density of 5 A/dm(2) yields a poorly crystallized Ni-P sublayer, while that at 10 A/dm(2) gives a crystalline one. Thus it is possible to o btain Cu/Ni-P multilayers with different crystallinity in the Ni-P sublayer by simply changing the cathodic current density. (C) 2001 Elsevier Science B.V. All rights reserved.