L. Zhang et Rs. Subramanian, A model of abrasive-free removal of copper films using an aqueous hydrogenperoxide-glycine solution, THIN SOL FI, 397(1-2), 2001, pp. 143-151
Using a recently formulated cell model for mass transport with chemical rea
ction in chemical-mechanical polishing, predictions are made for the rates
of chemical removal of copper from blanket films in a hydrogen peroxide sol
ution containing glycine, and compared with experimental observations. The
model requires input regarding the kinetics of the reaction, geometrical pa
rameters, and the relative velocity between the wafer and the pad. Predicti
ons of the removal rate as a function of the relative velocity between the
wafer and the pad at three different glycine concentrations are found to be
consistent with the trend displayed by experimentally measured results fro
m a chemical-mechanical polishing tool. (C) 2001 Elsevier Science B.V. All
rights reserved.