Numerous characterization techniques of the residual stress and the Young's
modulus of thin films based on the use of micromechanical devices have bee
n proposed in the litterature. After a short review of these methods, the p
erformances and limits of those exploiting the static deformations or the v
ibrations of cantilever microbeams and microbridges fabricated in the film
under investigation are analyzed in details. Some solutions are proposed to
improve their accuracy when they are applied to real microdevices whose ge
ometry is imperfect.