Ip. Smorchkova et al., AlN/GaN and (Al,Ga)N/AlN/GaN two-dimensional electron gas structures grownby plasma-assisted molecular-beam epitaxy, J APPL PHYS, 90(10), 2001, pp. 5196-5201
We report on an extensive study of the two-dimensional electron gas (2DEG)
structures containing AlN layers. It is shown that the presence of large po
larization fields in the AlN barrier layer in AlN/GaN heterostructures resu
lts in high values of the 2DEG sheet density of up to 3.6x10(13) cm(-2). Ro
om-temperature sheet resistance of 180 Omega/square is demonstrated in the
AlN/GaN structure with a 35 Angstrom AlN barrier. As a result of reduced al
loy disorder scattering, low-temperature electron mobility is significantly
enhanced in AlN/GaN heterostructures in comparison to AlGaN/GaN structures
with similar values of the 2DEG sheet density. The growth of GaN cap layer
s on top of AlN/GaN structures with relatively thick (similar to 35 Angstro
m) AlN barriers is found to lead to a significant decrease in the 2DEG shee
t density. However, inserting a thin (similar to 10 Angstrom) AlN layer bet
ween AlxGa1-xN and GaN in the AlxGa1-xN/GaN (x similar to0.2-0.45) 2DEG str
uctures does not affect the 2DEG sheet density and results in an increase o
f the low-temperature electron mobility in comparison to standard AlGaN/GaN
structures. At room temperature, a combination of the high 2DEG sheet dens
ity of 2.15x10(13) cm(-2) and high electron mobility of 1500 cm(2)/V s in A
l0.37Ga0.63N/AlN/GaN yielded a low sheet resistance value of 194 Omega/squa
re. (C) 2001 American Institute of Physics.