Si1-xGex layers were formed through high-dose germanium ion implantati
on into (100)Si substrates. Two alternative implantation techniques al
ong with that of the single-energy Ge+ implantation were separately ad
opted: the double-energy Si+ and Ge+ method, and the double-energy Ge and Ge++ method. The purpose of the both double-energy methods was to
form deeper amorphous layers by using relatively low-dose Si+ or Ge+ ion bombardment while the SiGe alloy layers were created by high dose
Ge+ ion implantations. Furthermore, all the amorphized samples were e
pitaxialy regrown by conventional furnace annealing at temperature of
525 to 600 degrees C. RES channeling spectroscopy was used for optimiz
ing these implantation processes. Measurements confirm that the double
-energy Ge+ and Ge++ method is optimum because of generating fewer res
idual defects. Additionally, the preliminary result on the regrowth pr
operties of the double-energy Ge+ and Ge++ implanted SiGe layer is als
o presented.