(111) silicon wafers were implanted with high ion doses of C+, N+ and C+ N+, from 1 x 10(16) to 6.7 x 10(17) cm(-2), well over the amorphization dos
e. For the largest dose, the mean impurity concentration in the implanted r
egion (of about 1000 Angstrom) at 30 keV is expected to be similar to the S
i atom density. Silicon nitride and silicon carbide formation is detected i
n the as-implanted samples. After annealing at 1200 degreesC a trend to seg
regation of Si3N4 and SiC in separated layers is observed, and a polycrysta
lline Si overlayer is formed. (C) 2001 Elsevier Science B.V. All rights res
erved.