Tin-silver and tin-copper alloys for capillarity joining-solft soldering of copper piping

It is studied the influence of the type of alloy used as filling material o n the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the setting of the sol dering heat input in each case to obtain the suitable capillarity features and alloying temperatures to achieve for the correct formation of the bondi ngs. Most defects in the joints arc demonstrated to be generated by bad dos sification of thermal inputs, which led depending on the filler alloy used to variations in its fluidity that may produce penetration failures in the bunds or insufficient consistency for the filling of the joints.