Citation
Zw. Sun et G. Dixit, Optimized bath control for void-free copper deposition, SOL ST TECH, 44(11), 2001, pp. 97
Citations number
12
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X
→ ACNP
Volume
44
Issue
11
Year of publication
2001
Database
ISI
SICI code
0038-111X(200111)44:11<97:OBCFVC>2.0.ZU;2-B
Abstract
A method for optimizing the control of organic additives in a plating bath
for copper interconnect applications is achieved by careful choice of the C
VS cycling parameters and the supporting electrolyte makeup.