In this paper, we report the RHEED and XPS studies of the decomposition of
silicon dioxide by the bombardment of metal ions and the growth of ultrathi
n crystalline zirconia oxide film on silicon. Through XPS analysis, it was
found that silicon dioxide could be decomposed by the bombardment of Zr ion
s in high temperature and lower partial pressure. Silicon dioxide was decom
posed into evaporated silicon oxide, while part of the oxygen in silicon di
oxide reacted with metal Zr ions to form stable zirconia oxide film. The me
tal ions reacted with silicon dioxide homogenously. Because of the smoothne
ss of native silicon dioxide surface and atomically abrupt silicon dioxide
interface with silicon, native oxide layer on silicon wafer was evenly remo
ved and a sharp stable crystalline zirconia oxide interface with silicon wa
s formed. The crystalline yittria-stabilized zirconia oxide (YSZ) film with
equivalent electrical oxide thickness 1.46 nm show excellent electrical pr
operties, the interface state density less than 2 x 10(11) eV(-1)cm(-2) and
leakage current 1.1 X 10(-3) A/cm(2) at 1.0 V bias. It demonstrates that t
his method can be used to the deposition of high-kappa metal oxide as alter
native dielectrics for future generation device.