TRIPLE JUNCTION AND GRAIN-BOUNDARY CHARACTER DISTRIBUTIONS IN METALLIC MATERIALS

Triple junction and grain boundary orientations were obtained by elect ron backscattered diffraction in high purity aluminium and copper, and in copper-bismuth alloys, and were then characterized using the CSL, CAD and I-line (O-lattice) geometrical models. A computer simulation w as also performed and compared to the experimental results. Relationsh ips were established between triple junction and grain boundary charac ter distributions using both experimental and computer simulated resul ts. A general trend was observed which shows an increase in special tr iple junction character density with increasing special grain boundary character content. An increased frequency of low angle and twin bound aries is shown to lead to an increase in the I-line triple junction de nsity. (C) 1997 Acta Metallurgica Inc.