Packaging using microelectromechanical technologies and planar components

A novel millimeter-wave packaging structure was developed in which a microm achined low-loss planar component and flip-chip devices were integrated on a silicon substrate. A low-loss planar filter was achieved on a 7-mm-square silicon substrate employing an inverted microstrip line and a unique reson ator. High attenuation in the stopband was also obtained by introducing a p ole control technique. Fabrication of a compact K-band receiver front-end i ncorporating a built-in filter was realized using multilayered benzocyclobu tene (BCB) and flip-chip bonding techniques. Furthermore, we propose an alt ernative BCB suspended structure and demonstrate a planar antenna for Ka-ba nd applications. These technologies bring to reality high-performance compa ct packaged systems in millimeter-wave region applications.