Thermosonics: Detecting cracks and adhesion defects using ultrasonic excitation and infrared imaging

Citation
Xy. Han et al., Thermosonics: Detecting cracks and adhesion defects using ultrasonic excitation and infrared imaging, J ADHESION, 76(2), 2001, pp. 151-162
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF ADHESION
ISSN journal
00218464 → ACNP
Volume
76
Issue
2
Year of publication
2001
Pages
151 - 162
Database
ISI
SICI code
0021-8464(2001)76:2<151:TDCAAD>2.0.ZU;2-M
Abstract
We describe a new nondestructive evaluation technique which makes cracks an d adhesion defects visible to infrared cameras. This is accomplished by inf using the sample with a short pulse of low frequency ultrasound. The sound causes the faying surfaces of defects to heat up by friction or clapping an d, thus, makes them visible in the infrared. Surface or near-surface defect s appear to the camera within milliseconds of the initiation of the ultraso nic pulse, while the appearance of subsurface defects is delayed by the the rmal propagation time from the defect to the surface being observed.