Evaluation of film-substrate interface durability using a shaft-loaded blister test

In this paper, an analytical solution is presented for a shaft-loaded blist er test for a thin film-substrate system. Both bending and stretching modes of deformation of the film are considered in the model. It is suggested th at film-substrate delamination behavior under a Mode I separation load is g overned by a parameter that relates the membrane stress to the rigidity of the film. The delamination behavior of several model thin film-substrate sy stems under repeated mechanical loads is studied. It is suggested from the results that film-substrate delamination under cyclic load depends on film rigidity, loading frequency, and film-substrate interfacial characteristics .