Multi chip modules technologies

In the past few years. impressive progresses in electronic devices and thei r packaging have been achieved. High energy physicists benefit from this. b eing able to minimise the amount of material in their Vertex-Detectors. Alt hough the environment of Vertex-Detectors is much more controlled and stabi lised than in the industry- or end-user-applications, the requirements of m aterial-budget and device complexity are higher. This paper tries to give a short overview of the existing Multi Chip Module technologies used in Vertex-Detectors and focuses on the prototyping resul ts of an upcoming Multi Chip Module technology, called Multi Chip Module-De posited (MCM-D), as it is planned to be used for the innermost part of the ATLAS Pixel detector. (C) 2001 Elsevier Science B.V. All rights reserved.