Investigating the microstructure-reliability relationship in Cu damascene lines

Authors
Field, DP Dornisch, D Tong, HH
Citation
Dp. Field et al., Investigating the microstructure-reliability relationship in Cu damascene lines, SCR MATER, 45(9), 2001, pp. 1069-1075
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
SCRIPTA MATERIALIA
ISSN journal
13596462 → ACNP
Volume
45
Issue
9
Year of publication
2001
Pages
1069 - 1075
Database
ISI
SICI code
1359-6462(20011107)45:9<1069:ITMRIC>2.0.ZU;2-H
Abstract
The present work focuses upon characterizing the effects of differing bath chemistries on microstructures of Cu damascene lines and the reliability of the test structures as determined from accelerated electromigration tests. Both, microstructure and electromigration lifetimes of Cu damascene lines can be altered substantially. (C) 2001 Acta Materialia Inc. Published by El sevier Science Ltd. All rights reserved.