By means of the electrodeposition technique, a bulk nanocrystalline (nc) co
pper sample was prepared with a high purity and a high density. The nc Cu s
ample was found to exhibit extreme extensibility under rolling at room temp
erature [Science, 287 (2000) 1463]. In this paper, the microstructure evolu
tion of the nc Cu during the cold-rolling process was examined by means of
X-ray diffraction (XRD) analysis, transmission electron microscopy (TEM) an
d differential scanning calorimetry (DSC). It was found in the initial stag
e of cold rolling that the microstrain and grain boundary energy increase s
ubstantially, while the crystallite size remains unchanged during the whole
process. When the degree of deformation exceeds 1000%, the microstrain and
the.-rain boundary energy tend to saturated values, implying that this def
ormation process is dominated by grain boundary activity rather than lattic
e dislocation. This phenomenon agrees well with the observed mechanical beh
avior of the nc Cu sample. (C) 2001 Acta Materialia Inc. Published by Elsev
ier Science Ltd. All rights reserved.